Four new semiconductor projects cleared in Odisha, Punjab & AP – Total Investment Reaches ₹1.6 Lakh Crore

The Union Cabinet, has approved four new semiconductor manufacturing projects under the India Semiconductor Mission (ISM), bringing the total to 10 projects across six states with an investment of ₹1.6 lakh crore. These initiatives are set to create over 2,000 skilled jobs directly and many more indirectly.

The new projects include:

• SiCSem Pvt Ltd (Odisha): India’s first Silicon Carbide (SiC) compound semiconductor fab in Bhubaneswar.
• 3D Glass Solutions Inc. (Odisha): Advanced packaging and glass substrate unit for AI, defense, and automotive sectors.
• ASIP Technologies (Andhra Pradesh): Chip manufacturing for mobiles, set-top boxes, and consumer electronics.
• CDIL (Punjab): Brownfield expansion in Mohali for high-power devices like MOSFETs and IGBTs.

These projects serve sectors like EVs, telecom, defense, AI, and renewable energy, and are backed by government-supported design programs involving 278 academic institutions, 72 startups, and training for 60,000+ students.